At FMS 2015, Samsung made a number of new announcements one of which is Samsung’s upcoming PM953 PCIe SSD, which will likely be the successor to the Samsung SM951 we reviewed previously. The Samsung PM953 will come in both the M.2 PCIe and 2.5″ SFF form factors, feature a PCIe Gen 3 x4 interface, and it’ll have full support for NVMe.
Unlike the Samsung SM951 which used planar NAND, the Samsung PM953 will utilize Samsung’s latest 256Gb 48-layer 3-bit MLC 3D V-NAND. This will allow the PM953 to support drive capacities of 480GB and 960GB in the M.2 form factor and 2TB (1920GB) in the 2.5″ SFF form factor. Performance on the drive is [...]
For FMS 2015, Phison showcased two upcoming controllers. The first and the most interesting is the Phison PS5007-E7 controller. Designed for the next generation of NVMe SSDs, the PS5007-E7 is a PCIe Gen3 x4 controller with full support for NVMe 1.2. As expected, it’ll support all current and upcoming flash from every vendor including 2-bit MLC (MLC), 3-bit MLC (TLC), and 3D NAND. Maximum capacity supported on the PS5007-E7 is 4TB.
Phison claims that the PS5007-E7 support sequential read/write speeds up to 2500/1300 MB/s respectively and random read/write performance of up to 350,000/250,000 IOPS. This makes the Phison PS5007-E7 significantly faster than its [...]
At Computex earlier this year, we got our first glimpse at the Silicon Motion SM2260 controller, but only a few basic details were shared at the time. Silicon Motion promised some additional details at FMS, so we decided to check out their booth to take a look at their next generation controller.
According to Silicon Motion, the SM2260 will be the first turnkey PCIe Gen 3 x4 NVMe 1.2 SSD controller solution. The SM2260 uses a high performance 8 channel design and support pretty much every type of NAND. This includes MLC (2-bit MLC), TLC (3-bit MLC), and upcoming 3D NAND from every major vendor.
The Silicon Motion SM2260 claims a maximum performance up to [...]
As reported previously, Samsung unveiled their 3rd generation 3D V-NAND and at their keynote, Samsung shared a few more details on the new NAND.
As expected, the 3rd generation 256Gb 3-bit 48-Layer MLC 3D V-NAND has 1.4x more density per wafer.
With the additional density is also additional performance and power efficiency. According to Samsung, their 48-layer 3-bit MLC 3D V-NAND produces up to 2x the performance sequential reads and 2.2x the performance sequential writes. Power efficiency is also significantly improved with reductions of up to 63% lower read and 54% write power consumption.
As presented before, Samsung believes [...]
During their keynote at FMS, Toshiba also announced that they’ll be producing the world’s first 8-stack and 16-stack TSV (Through-Silicon-Via) NAND packages. Thanks to TSV NAND stacking, Toshiba is able to attain performance up to 1.2Gbps throughput per package and reduce power consumption by up to 60% compared to current generation NAND flash packaging.
Denser NAND stacking thanks to TSV will also allow even smaller form factors as more NAND dies are crammed into a single NAND package. With next generation 256Gb NAND dies, a 16-stack NAND package would theoretically provide incredible capacities up to 512GB per package.
Toshiba has not given a [...]
FMS 2015 has been a big show this year with multiple vendors announcing new 3D NAND technologies. Alongside Toshiba’s announcement last week that they’re soon sampling their 256Gb 48-layer BiCS 3D NAND product, Toshiba also announced something very interesting at the show – QLC (Quadruple Level Cell) BiCS FLASH.
According to Toshiba, QLC BiCS is currently planned for “archival SSDs” where cost and capacity outweigh the need for performance. Toshiba believes that QLC BiCS will still carry longer endurance than current generation MLC NAND despite being able to store 4x the capacity per die. As far as I know, Toshiba is currently the [...]
Samsung has begun mass production of the industry’s first 256Gb 48-layer 3-bit MLC (TLC)3D V-NAND flash memory just one year after the launch of their 32-Layer TLC 3D V-NAND.
The improved stack height allows for increased densities per NAND chip. The new 48-layer TLC 3D NAND extends the maximum storage-per-die ratio to 32GB/die, twice that of the current 16GB/die ceiling of 32-layer TLC. The higher density chips could easily be implemented to the current line-up of SSDs and double their capacities.
The new 3D V-NAND chips also cuts down on power draw and production cost. According to Samsung’s press release, Samsung’s 48-layer TLC 3D V-NAND [...]
Toshiba is once again raising the bar in enterprise storage with the release of their new PX04S line of SAS SSDs.
Leveraging Toshiba’s in-house 19nm eMLC NAND along with a Toshiba/Marvell co-branded controller, the PX04S line is designed and built by Toshiba to ensure the utmost quality and performance.
The PX04S series SAS SSDs will come in four different SKUs, each designed for a different workload. The highest endurance SKU designed for write intensive workloads, the PX04SHB, is rated at up to 25 DWPD (Drive Writes Per Day) while the low endurance SKU designed for read intensive workloads, the PX04SRB, is rated at up to [...]
After announcing their multi-year “strategic” partnership back in February of this year, Seagate and Micron is now reaping the fruits of their labor with a brand new SAS SSD designed for the enterprise market.
Marketed as the Seagate 1200.2 by Seagate and the Micron S600DC Series by Micron, the drives will utilize custom Seagate controller technology along with Micron’s MLC NAND.
The Seagate 1200.2 will be offered in four different configurations depending on the needs of the customer. Those who need drives for write intensive tasks can purchase drives rated up to 25DWPD (Drive Write Per Day) while those who [...]
Following their announcement earlier this year that their 128Gb 48-layer BiCS 3D NAND was shipping, Toshiba and SanDisk recently announced that they’ve also developed the world’s first 256Gb 48-layer BiCS 3D NAND. In order to do this, they’ve leveraged TLC (3-bit per cell MLC) technology to cram additional capacity into the NAND die. While they’re not really the first to develop 3D NAND nor are they the first to announce 256Gb dies, they are the first to reach 256Gb dies in a 48-layer 3D NAND which is still very impressive.
“From day one, Toshiba’s strategy has been to extend our floating gate technology, which features the [...]
Two of Intel’s upcoming Skylake-S desktop processors have been put up for sale on Ebay Australia two days before their official launch which is expected at Gamescom.
The 14 nm based Skylake Intel Core i7-6700K and the Intel Core i5-6600K can now be purchased from unofficial Australian Ebay retailers for $649.99 AUD and $469.99 AUD. Because it’s made purchasable before launch, it’s possible that the prices of the chips are inflated and will change after the official release.
Both processors belong to Intel’s enthusiast grade CPUs aimed at high-performance machines and gamers. As such, both chips are unlocked with a TDP of 95W. The [...]
At E3 this year, I had a chance to check out several indie developers who were developing some pretty promising new games. One of the studios I checked out was Mandragora Studio who’s currently developing the Steam Greenlight game, Skyhill. As most of you probably have never heard of Skyhill, let’s first answer the question “What is Skyhill?”
Aside from the game name, “Skyhill” is actually a luxury hotel in the game in which you, as the game’s protagonist, have recently rented a penthouse in. Unfortunately, something happens – something evil, something inexplicable. The building then begins filling up with monsters and mutants [...]