Memory
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March 21, 2017

Corsair Releases Vegeance RGB DDR4 Memory

Corsair’s new Vengeance DDR4 modules adds *you guessed it* RGB lighting to its distinct heat spreaders.

Unlike many other RGB memory lighting kits, users can configure the lighting to react to temperature changes or set them to a variety of pre-configured lighting patterns including breathing, static, and rainbow. Lighting profiles can be configured through CORSAIR LINK, Corsair’s monitoring software for its power supplies and other components.

As with the previous Vengeance memory modules, the Vengeance RGB is designed for overclocking and has support for XMP 2.0.

The kits are available starting today in 16GB (2 x 8GB), 32GB (4 x 8GB), and [...]

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February 16, 2017

DRAM Shortages Result in 30% Price Increase in 4Q2016

It’s good to be in the DRAM business these days. According to a recent report from DRAMeXchange, global DRAM revenues have increased 18.2% sequentially for 4Q2016.

Much of the demand is fueled by strong smartphone sales, particularly Chinese brands along with the iPhone 7. This has resulted in massive shortages of PC DRAM, resulting in a 30% price increase over the previous quarter. Server DRAM is expected to follow suit in 1Q2017.

Memory manufacturers are currently increasing efforts to expand DRAM production capacity, but their efforts aren’t expected to be realized until the 2H2017. As a result, the supply problem is expected to continue to [...]

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February 9, 2017

TSMC 7nm Process Ready to Go, Samsung 7nm Still in Development

At the International Solid State Circuit Conference (ISSCC), both TSMC and Samsung had working chips samples built on their respective 7nm nodes. However, the two companies gave very different outlooks on their readiness.

According to the presentation offered by TSMC, they described the condition of their 7nm node as “healthy”. Samsung on the other hand, had a bit less confidence in its production method, showcasing a development chip that suggests 7nm chips may not be ready for at least a few more years.

The reason behind the contradicting prospects is due to the different manufacturing techniques. Because TSMC will likely be producing the Apple A11 [...]

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February 6, 2017

SK Hynix Makes Bid for Stake in Toshiba Memory Business

In a recent report from Reuters, SK Hynix may be among the suitors in the running for a stake in Toshiba’s memory business. According to an undisclosed source, SK Hynix has already submitted an initial bid for Toshiba’s memory business although no information as to how much of a stake SK Hynix is interested in purchasing.

Toshiba had recently fallen on some hard times with a failing nuclear power business and an accounting scandal that left their previous CEO out of a job and the company in billions of dollars in debt. In an attempt to protect the still profitable memory business and help keep Toshiba alive a bit longer, Toshiba spun off the memory business [...]

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January 31, 2017

SK Hynix Readies 4GB 2nd Gen HBM2 for 1Q 2017 Launch

According to SK Hynix 1Q2017 Databook for graphics, it’s confirmed that SK Hynix’s 4GB HBM2 memory modules are getting ready for production in 1Q2017.

One of the hottest consumer products that is expected to take advantage of HBM2 is AMD’s highly anticipated Vega graphics cards. Among the memory lineup, the 5mKGSD SKU is the most likely candidate to be featured on the Vega GPU. The 5mKGSD configuration is 4 stacks tall and features a memory density of 4GB/ stack. At CES 2017, we saw a glimpse of an engineering sample of Vega carrying 2 stacks of HBM2 on its interposer. It was rumored to have 8GB of VRAM, which helps confirm our [...]

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January 28, 2017

Intel Launching Optane SSD in 1Q2017, 3D XPoint DIMM Now Sampling

Intel’s 3D XPoint has been long touted as a revolutionary new non-volatile memory technology ever since Intel announced it back in 2015. Unlike traditional NAND, 3D XPoint uses a mesh of storage cells that can greatly improve access times compared to conventional storage. According to Intel’s internal testing, Optane SSDs can reach speeds up to 10x faster than current generation SSDs. However since its launch, 3D XPoint has been more talk than anything else with both Intel and development partner, Micron, doing little more than talking about the performance, applications, and missing potential launch dates.

That said, this time it appears that Intel may [...]

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January 25, 2017

Tsinghua Unigroup to Invest $30 Billion in Nanjing Memory Fab, Increasing Total Fab Investment to $70 Billion

It’s no secret that China wants advanced chip manufacturing technology and will do whatever it takes to get it. However, after several failed attempts by China’s state sponsored technology investment group, Tsinghua Unigroup, to acquire US chip manufacturing companies such as Western Digital and Micron, it appears that they have given up on acquiring the manufacturing capability altogether and have decided invest into building their own manufacturing capability instead.

According to a recent statement from Tsinghua Unigroup, the investment group recently revealed plans to invest $30 billion into the construction and development of a DRAM and 3D NAND fab in [...]

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January 17, 2017

CES 2017: HyperX Shows Off HyperX Predator RGB DDR4 Memory, Cloud Revolver S Headset, ALLOY Elite RGB Keyboard, Pulsefire Mouse

Down the hall from Kingston’s CES 2017 suite was HyperX, the gaming and performance components division of Kingston, which now seems to be becoming more independent than ever.

The most impressive showing at the HyperX suite was their upcoming HyperX Predator LED which is an upcoming RGB LED lit high performance memory kit. Unlike other kits on the market, the HyperX Predator LED is able to communicate with the system directly through the memory slots through a proprietary method which is supposed by all the biggest motherboard makers such as ASUS, Gigabyte and MSI. With this, the LEDs on the HyperX Predator LED can be controlled via a software application [...]

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November 15, 2016

Multiple Chinese Firms to Enter DRAM, NAND Market in 2018

Although the DRAM and NAND industry has seen quite a bit of consolidation over the past 10 years, it looks like some new players from China may be entering the market soon bringing some welcome competition to the market. According to a recent article by DigiTimes, three China based firms may be gearing up to enter the market with all three expected to begin competing for the Chinese market in 2018.

 

Yangtze River Storage Technology (YRST)

YRST, or Yangtze River Storage Technology, is the most promising of the companies as it’s backed by Tsinghua Unigroup, a Chinese state run technology company. YRST already owns a 12-inch wafer fab which is [...]

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October 31, 2016

Samsung to Develop, Begin Mass Production of 15/16nm DRAM Next Year

Samsung recently told investors that they’re planning to make some of the biggest investments into their semiconductor facilities this year and the accelerated development of next generation DRAM may be one of the results of that investment.

According to Business Korea sources, Samsung is planning to accelerate development their next generation 1ynm product (15nm or 16nm) in order to begin mass producing it by 2H2017. Further, Samsung expects to continue ramping up 18nm DRAM production as well, expecting 10nm class DRAM to make up half of Samsung’s DRAM shipments by 2H2017.

It was previously estimated that Samsung would completely shift to 10nm DRAM [...]

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