Posts Tagged ‘Roadmap’
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November 8, 2017

AMD RTG Chief Raja Koduri Leaves AMD, Joins Intel’s New Core and Visual Computing Group

AMD’s former Radeon Technology Group Chief, Raja Koduri, has had an eventful week. After Hexus recently reported on an internal memo Koduri sent to his staff announcing his departure from AMD, Intel recently sent out a press release announcing that Koduri has joined Intel’s newly formed Core and Visual Computing Group.

Back in September, Koduri announced that he’d be going on a sabbatical for personal reasons. In an email, he explained to his staff that he was taking a temporary break to spend some time with his family. Given that Koduri had just overseen AMD’s launch their latest Vega GPU, it didn’t seem like a huge deal at the time. [...]

 
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September 27, 2017

AMD 12nm Ryzen Pinnacle Ridge CPUs Rumored to Launch February 2018

According to a report from Digitimes, AMD has revealed to its motherboard partners that it plans to launch its next generation 12nm Ryzen CPUs in February of 2018. The new CPUs will be manufactured on Global Foundries upcoming 12nm process.

The upcoming 12nm Ryzen CPUs will be codenamed Pinnacle Ridge and will feature both a die shrink as well as architecture improvements over current generation Summit Ridge Ryzen CPUs. Like Summit Ridge, Pinnacle Ridge will be divided into Pinnacle 7, Pinnacle 5, and Pinnacle 3. Pinnacle 7 will be launching first in February 2018 followed by Pinnacle 5 and 3 in March 2018. Following these will also be the Pinnacle Ridge low power in [...]

 
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September 18, 2017

Mainstream Intel 8-Core/16-Thread CPUs Rumored for 2018

Several weeks ago, an Intel presentation slide was leaked detailing Intel’s upcoming chipset roadmap. The roadmap revealed a previously unknown Z390 chipset, which is a consumer enthusiast chipset coming in the 2H2018.

At the time, little additional details of the upcoming chipset was revealed however, according to a recent forum post on Notebook Review by a representative for system integrator, Eurocom, it appears that the Z390 chipset will support 8-core/16-thread CPUs that Intel may be releasing to accompany the new chipset. If this rumor is accurate, this will be the first time Intel’s mainstream platform will have 8-core/16-thread [...]

 
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September 11, 2017

Samsung 11nm LPP, 7nm LPP with EUV Slated for 2018

Samsung is continuing the push to the limits of process technology as the company recently revealed two of its newest manufacturing processes, 11nm LPP (Low Power Plus) and 7nm LPP with EUV.

According to the announcement, Samsung’s new 11nm LPP is an alternative process to the 10nm FinFET process designed for mid-range to high end mobile processors. The 11nm LPP process offers up to 15% higher performance and up to 10% chip area reduction while drawing the same amount of power as their current 14nm LPP process. The new process is scheduled for production in the 1H2018.

Following the 11nm LPP process is the 7nm LPP process with EUV (Extreme Ultra Violet) [...]

 
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September 8, 2017

Intel Chipset Roadmap Reveals Z390 Chipset in 2H2018

User NVGPU on the AnandTech forums recently posted what appears to be an official slide from Intel showing the upcoming chipset roadmap for 3Q2016 to the 2H2018.

For the 300 series, Intel is updating the entire lineup of chipsets likely due to the new socket being introduced. An interesting new reveal is the flagship Z390 chipset which is expected to be launched in the 2H2018. It’s the first time we’ve seen mention of the Z390 chipset and no further details were made available at this time.

The roadmap is also bad news for those looking to pick up lower cost H370 and H310 motherboards as the roadmap suggests we will only see Z370 motherboards this [...]

 
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August 9, 2017

Samsung Announces 96-Layer QLC V-NAND, NGSFF, SZ985 Z-NAND SSD at FMS 2017

For FMS 2017, Samsung shared several new releases along with its SSD/NAND flash roadmap for the coming years. Among the new releases include Samsung’s 96-Layer QLC (Quad Level Cell) NAND and a few new enterprise SSDs.

 

64-Layer 3D V-NAND Transition

Samsung is already transitioning its entire line of products to utilize 4th Generation 64-layer 3D V-NAND. Their 64-Layer 3D V-NAND has been in mass production since June of this year and promises to be 30% faster, 30% more power efficient, and 20% more reliable than previous generation 48-layer 3D V-NAND.

This could potentially mean that Samsung’s successor to the 960 Pro and 960 Evo [...]

 
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August 7, 2017

Intel Coffee Lake Platform Details Leaked in Presentation Slides

As the Intel’s upcoming 8th Generation Core Processors, codename Coffee Lake, nears its official launch, numerous leaks have been springing up on the CPUs. However, little was previously known about the Coffee Lake platform and chipset. Until now.

In a new leak, we now have what appears to be official Intel presentation slides on the upcoming processors as well as information about the chipset and platform.

For starters, here’s the roadmap for Intel’s desktop CPUs from 2Q2017 to 2Q2018. We can see that Coffee Lake-S CPUs along with Kaby Lake Refresh PCH are expected to launch sometime towards the tail end of 3Q2017 with the Cannon Lake [...]

 
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July 31, 2017

AMD Reveals Ryzen Threadripper 1950X, 1920X, 1900X Pricing and Availability

During AMD’s SIGGRAPH event, the company finally revealed the full details, lineup and availability of their highly anticipated Ryzen Threadripper CPUs.

AMD will release three products into the Ryzen Threadripper family. At the top of the stack is the Ryzen Threadripper 1950X, which will feature 16-cores/32-threads, a base clock of 3.4GHz, a turbo clock of 4.0GHz + XFR to 4.2GHz, 180w TDP and will retail for $999 starting August 10. In the middle is the Ryzen Threadripper 1920X, which will feature 12-cores/24-threads, a base clock of 3.5GHz, a turbo clock of 4.0GHz + XFR to 4.2GHz, 180w TDP and will retail for $999 starting August 10. Of course, most of [...]

 
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July 24, 2017

Toshiba First to Unveil QLC NAND Flash Memory Packing 768Gb Per Die, Up to 1.5TB Per Package

Over the past few months, there hasn’t been a whole lot of good news coming out of Toshiba, but here’s a recent announcement that I think we can all appreciate. In a recent announcement, Toshiba shared news that they’ve developed the industry’s first 4-bit per cell, Quad Level Cell (QLC) BiCS NAND flash memory chips.

The new QLC NAND features a 64-layer cell structure and boasts up to 768Gbit / 96GB per die making it currently the densest dies on the market. By using 16 dies, Toshiba is able to cram as much as 1.5 TB in a single package. This is a 50% increase over a comparable TLC NAND package with the same number of dies.

“From SLC to [...]

 
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May 24, 2017

AMD 7nm Products To Tape Out This Year

In an AMD investors meeting, AMD CEO Lisa Su confirmed that AMD’s 7nm products will tape out this year.

To clear up some confusion, the tape out stage is where the design is finalized and sent for manufacturing. It’s unlikely that we will see the products until a few months after the tape out period.

In AMD’s product roadmap, both its upcoming Navi GPU and Zen 2 CPU will be based on 7nm FinFETs. The roadmap places Zen2 somewhere around 2018 and 2019, while Zen 3, based on 7nm FinFET+, will arrive sometime around 2020.

 

Source: WCCFTech

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