Phison today launched their new Phison PS8313 UFS 2.1 controller at FMS 2017.
Designed for top tier mobile chipsets and smartphones, the Phison PS8313 integrates their CoXProcessor 2.0 architecture currently used on Phison’s PCIe controllers for improved performance and reliability in the UFS standard. The PS8313 controller also features use of an advanced 28nm manufacturing process, a 2-lane UFS interface, an ultra compact and low power LDPC ECC engine and support for the latest 3D TLC NAND.
According to Phison’s internal testing, the PS8313 is capable of up to 920/550 MB/s sequential reads/writes and 67K/62K IOPS 4K random read performance when [...]
To meet the capacity and performance demands of the rapidly developing IoT industry, Toshiba is introducing the BG3 SDD, a tiny, single-package SSD for thinner, more reliable mobile and embedded devices.
As the successor to the BG2, the BG3 uses Toshiba’s 64-layer TLC NAND for higher storage density per drive. It also features a DRAM-less design for better power consumption, lower cost, and a smaller footprint.
Utilizing two PCIe 3.0 lanes and Toshiba’s in-house controller, the BG3 can achieve sequential read/write speeds of up to 1,520MB/840MB/s respectively. The BG3 also has an SLC caching feature which can boost performance when the drive [...]
With the NAND shortage in full effect at CES this year, SSDs didn’t really make much of an appearance at the show. However, we did get a chance to stop by controller vendor, Phison, who had a new entry level PCIe NVMe controller to show.
The new controller is the Phison E8 which is going to be the low cost brother to the Phison E7. The new controller will come in two variants: the PS5008-E8 or PS5008-E8T.
The Phison PS5008-E8 will be a PCIe Gen 3 x2 controller featuring performance up to 1.6GB/s sequential reads and 1.3GB/s sequential writes. Random read/write performance will top out at 240K/220K IOPS respectively. It’ll also feature [...]
For CES 2017, Toshiba showed off its new BG series SSD in the M.2 1620 BGA and M.2 2230 form factor for ultraportables and mobile devices.
Powered by Toshiba BiCS 3D TLC NAND along with a Toshiba controller, the Toshiba BG series demonstrates the capabilities of Toshiba’s 3D TLC, scaling up to capacities of 512GB in a form factor as small as 16x20mm. In order to achieve this, Toshiba integrated the controller and the NAND into a single package, and as the drive utilizes NVMe’s Host Memory Buffer (HMB) feature which utilizes system DRAM to act as a buffer, DRAM is not required.
The Toshiba BG M.2 1620 SSDs are designed to be integrated into [...]
Hot on the heels of Toshiba’s recent 64-layer 3rd Generation BiCS 3D NAND announcement, Toshiba also recently announced their upcoming BG series SSDs designed for tablet and ultraportable applications.
Available in capacities of 128GB, 256GB, or 512GB, what’s special about Toshiba’s BG series SSDs is that it come in either a 16mm x 20mm BGA package or in a M.2 2230 module. In order to achieve such capacities in such a small form factor, Toshiba is using an in-house controller solution combined with their BiCS TLC 3D NAND packaged into a single chip. Further reducing size, Toshiba removed the need for onboard DRAM by taking advantage of the NVMe [...]
FMS was a huge show for Toshiba this year and at their booth, they showed off several new NVMe-based PCIe and SAS SSDs for both their client and enterprise storage lines.
The Toshiba XG3 SSD family is designed for high-performance notebooks and PCs. Utilizing a Toshiba branded controller (likely a jointly developed controller with Phison) along with Toshiba 15nm MLC, the XG3 is capable up to 2,400/1,500 MB/s sequential reads/writes thanks to its PCIe Gen 3 x4 NVMe interface. As usual, Toshiba also brings their proprietary QSBC (Quadruple Swing-By Code) ECC algorithms.
Maximum capacity on the XG3 is 1TB with a dual sided M.2 2280 form factor drive. [...]
It’s no secret that AMD’s high end desktop CPU business has been stumbling for the past few years. Whereas Intel has been improving their high end microarchitecture for the past few years, AMD has shifted their focus into the low end and the mainstream however, according to some new leaked slides, AMD may finally be gearing up for a fight come 2016.
The leaked slides show that AMD is aiming to replace its current Piledriver based lineup of performance FX CPUs with a new chip called Summit Ridge in 2016. Capable of hosting up to 8 cores, Summit Ridge will be using AMD’s upcoming “Zen” architecture built on the 14nm FinFet manufacturing [...]
Hightech Information System (HIS) today introduces HIS 7970 X. The card is not only of HIS top class but is also the best of the best among 7970 cards. The 4-way crossfire HIS 7970 X achieved the number 1 world records on both 3dMark Vantage and 3Dmark 11 with 84669 and 29937 marks respectively. The card also won the ASRock Z77 Overclocking Competition on 3D mark.com
HIS 7970 X is overflown with special features such as X elements, IceQ X², iTurbo, PowerTune with Boost, OC equipment and [...]
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