Posts Tagged ‘Toshiba’
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February 14, 2017

Toshiba Planning Majority Stake Sale in Memory Business

Struggling Japanese conglomerate Toshiba just can’t seem to catch a break. According to a recent announcement, the company is now expecting a 712.5 billion Yen ($6.3 billion) writedown of losses stemming from their nuclear power business, resulting in a net income loss of 390 billion Yen ($3.4 Billion).

As a result of the recent projections release, Toshiba Chairman Shinegori Shiga has stepped down from his role as chairman and Toshiba is now reportedly planning to sell a majority stake in their memory business to cover their losses. Toshiba’s memory business was previously expected to be spun off by the end of March with Toshiba selling a 20% stake to [...]

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February 9, 2017

Toshiba Begins Construction of Fab 6 and R&D Center

Despite Toshiba’s financial woes, their memory division is pressing on, recently announcing that they’ve begun construction on their latest semiconductor fabrication facility, Fab 6 at Yokkaichi, Japan.

Like all the other new fabs that were constructed or retrofitted, Fab 6 will be built to produce Toshiba’s latest BiCS 3D NAND flash. Construction of the new fab will occur in two phases with Phase 1 slated to be complete in the summer of 2018. This will allow Toshiba to re-evaluate and re-asses continued investment in the event NAND flash demand takes a nosedive.

In addition to Fab 6, Toshiba also announced the construction of a new Memory [...]

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February 8, 2017

Western Digital, Toshiba Introduces 512Gb, 64-layer TLC BICS 3D NAND

Western Digital and Toshiba had some great news to announce at the International Solid State Circuits Conference (ISSCC) recently as they revealed that they’ve begun initial production of their BICS3 512Gb, 64-layer TLC 3D NAND at their NAND fabrication facility at Yokkaichi, Japan.

The new 512Gb, 64-layer BICS3 TLC 3D NAND will be the highest density NAND dies announced to date, matching Samsung’s 4th Generation V-NAND which also features 64-layers and 512Gb density. Full production of the new BICS3 NAND is expected to begin in 2H2017.

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February 6, 2017

SK Hynix Makes Bid for Stake in Toshiba Memory Business

In a recent report from Reuters, SK Hynix may be among the suitors in the running for a stake in Toshiba’s memory business. According to an undisclosed source, SK Hynix has already submitted an initial bid for Toshiba’s memory business although no information as to how much of a stake SK Hynix is interested in purchasing.

Toshiba had recently fallen on some hard times with a failing nuclear power business and an accounting scandal that left their previous CEO out of a job and the company in billions of dollars in debt. In an attempt to protect the still profitable memory business and help keep Toshiba alive a bit longer, Toshiba spun off the memory business [...]

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February 1, 2017

HGST HDDs Most Reliable Once Again as Backblaze Releases 2016 Hard Drive Failure Stats

Popular low cost cloud storage company Backblaze recently shared their hard drive failure rates for 2016 and to no surprise, HGST is once again the most reliable HDD maker.

According to the stats, Backblaze has a total of 71,939 HDDs in their datacenter and 1,225 of them failed in 2016. Most of the failures came from Seagate’s 4TB ST4000DM000 drives which saw 938 of the 34,738 drives fail over the year with an average age of 21.73 months.

Aggregating all the hard drive failures by manufacturer, the hard drive maker with the least failure rates once again was HGST which only experienced a failure rate of 0.60%. The drivemaker with the [...]

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January 27, 2017

Toshiba Officially Spinning Off Memory Business by March 31, 2017

Several days ago, we heard rumors that Toshiba may be considering spinning off their memory business and today, Toshiba is making it official. According to a recent announcement from the financially troubled company, Toshiba will spin off their memory business (including SSD) into a wholly owned subsidiary by March 31, 2017.

This is a strategic move by Toshiba to protect its financially strong memory business and utilize it to raise much needed third party capital. In addition to the fallout from its massive accounting scandal in 2015, it was recently revealed that Toshiba’s nuclear power business had significantly greater than expected losses of 680 billion yen [...]

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January 20, 2017

Toshiba May Spin-Off Part of Semiconductor Business, Western Digital Possible Suitor

It’s no secret that Toshiba has been struggling over the past few years. In 2015, their CEO, Hisao Tanaka, stepped down over a major accounting scandal back where it was determined that they had over-reported operating profits by a tune of $1.2 Billion USD over the course of seven years. More recently Toshiba is looking at possibly writing off several billion US dollars due to massive losses in their nuclear power division.

In an effort to raise some capital, a new report from Nikkei Asian Review, suggests that Toshiba may be looking at spinning off their NAND/semiconductor business and selling approximately 20% interest in the company. This would help raise [...]

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January 11, 2017

CES 2017: Toshiba Puts 512GB NVMe SSD into Tiny 16x20mm BGA Form Factor

For CES 2017, Toshiba showed off its new BG series SSD in the M.2 1620 BGA and M.2 2230 form factor for ultraportables and mobile devices.

Powered by Toshiba BiCS 3D TLC NAND along with a Toshiba controller, the Toshiba BG series demonstrates the capabilities of Toshiba’s 3D TLC, scaling up to capacities of 512GB in a form factor as small as 16x20mm. In order to achieve this, Toshiba integrated the controller and the NAND into a single package, and as the drive utilizes NVMe’s Host Memory Buffer (HMB) feature which utilizes system DRAM to act as a buffer, DRAM is not required.

The Toshiba BG M.2 1620 SSDs are designed to be integrated into [...]

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November 10, 2016

Toshiba Building New 3D NAND Fab, Expects Construction to Begin February 2017

Looks like Toshiba is ramping up big time with their 3D NAND as they recently announced plans to begin construction on a new state of the art fabrication facility at Yokkaichi Operations in order to expand production of their BiCS 3D NAND technology.

The construction of the new fab is expected to begin February 2017. Like their relatively recently completed Fab 5 facility also in Yokkaichi Operations, Toshiba will construct their new fab in two stages with the first stage expected to be completed by summer 2018. Toshiba will also build a new Memory R&D Center in order to help promote flash memory development by moving all flash memory R&D personnel to the new [...]

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October 6, 2016

Toshiba 48-Layer 3D BiCS NAND Discovered in Apple iPhone 7

Some keen eyes from the guys over at TechInsights recently discovered that the NAND onboard the Apple’s iPhone 7 will come from multiple sources. In a number of teardowns of the new smartphone, the iPhone 7 appears to source NAND from SK Hynix and Toshiba. While this isn’t interesting news as these companies are popular suppliers of NAND, what’s interesting is that certain capacities are using Toshiba’s 48-Layer 3D BiCS NAND, which has never been seen previously on a commercial product.

The Toshiba BiCS 3D NAND in question is the Toshiba THGBX6T1T82LFXF which is being used on the iPhone 7 256GB model. TechInsights is currently conducting a full [...]

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