For CES 2017, Toshiba showed off its new BG series SSD in the M.2 1620 BGA and M.2 2230 form factor for ultraportables and mobile devices.
Powered by Toshiba BiCS 3D TLC NAND along with a Toshiba controller, the Toshiba BG series demonstrates the capabilities of Toshiba’s 3D TLC, scaling up to capacities of 512GB in a form factor as small as 16x20mm. In order to achieve this, Toshiba integrated the controller and the NAND into a single package, and as the drive utilizes NVMe’s Host Memory Buffer (HMB) feature which utilizes system DRAM to act as a buffer, DRAM is not required.
The Toshiba BG M.2 1620 SSDs are designed to be integrated into [...]
Looks like Toshiba is ramping up big time with their 3D NAND as they recently announced plans to begin construction on a new state of the art fabrication facility at Yokkaichi Operations in order to expand production of their BiCS 3D NAND technology.
The construction of the new fab is expected to begin February 2017. Like their relatively recently completed Fab 5 facility also in Yokkaichi Operations, Toshiba will construct their new fab in two stages with the first stage expected to be completed by summer 2018. Toshiba will also build a new Memory R&D Center in order to help promote flash memory development by moving all flash memory R&D personnel to the [...]
Some keen eyes from the guys over at TechInsights recently discovered that the NAND onboard the Apple’s iPhone 7 will come from multiple sources. In a number of teardowns of the new smartphone, the iPhone 7 appears to source NAND from SK Hynix and Toshiba. While this isn’t interesting news as these companies are popular suppliers of NAND, what’s interesting is that certain capacities are using Toshiba’s 48-Layer 3D BiCS NAND, which has never been seen previously on a commercial product.
The Toshiba BiCS 3D NAND in question is the Toshiba THGBX6T1T82LFXF which is being used on the iPhone 7 256GB model. TechInsights is currently conducting a [...]
Ever since Toshiba’s acquisition of OCZ back in 2014, we’ve seen a gradual move away from not only the OCZ branding, but also many Toshiba inspired internal changes in its SSDs. OCZ, which changed its name to OCZ Storage Solutions last year, is now Toshiba OCZ and the SSDs themselves are now practically re-branded Toshiba products with slightly modified firmware, additional bundled software, and modified retail packaging for the consumer SSD market. Why Toshiba hasn’t dropped the entire OCZ brand as a whole I’m not quite sure, but it seems like they’re preparing to drop the [...]
Market intelligence firm TrendFocus recently released a report on the SSD market for calendar Q2 and as you’d expect, the SSD and NAND market is doing very well.
Client SSDs did the best shipping nearly 30 million units representing a total of 8.24 exabytes, or 66% of the total 12.41 exabytes shipped in Q2. This is 7% higher than the original forecast with shipment increases seen in all form factors and market segments.
Enterprise SSDs didn’t do so bad either, shipping 4.068 million units representing a total of 4.17 exabytes, or 34% of the total 12.41 exabytes shipped in Q2. This is a healthy 10% increase over Q1 with shipment increases seen in [...]
Hot on the heels of Toshiba’s recent 64-layer 3rd Generation BiCS 3D NAND announcement, Toshiba also recently announced their upcoming BG series SSDs designed for tablet and ultraportable applications.
Available in capacities of 128GB, 256GB, or 512GB, what’s special about Toshiba’s BG series SSDs is that it come in either a 16mm x 20mm BGA package or in a M.2 2230 module. In order to achieve such capacities in such a small form factor, Toshiba is using an in-house controller solution combined with their BiCS TLC 3D NAND packaged into a single chip. Further reducing size, Toshiba removed the need for onboard DRAM by taking advantage of the NVMe [...]
Toshiba and Western Digital recently announced that they’ve completed development on BiCS3, their third generation BiCS 3D NAND. According to the announcement, BiCS3 utilizes a 64-layer design and will be available in 256-bit and later on in 512-bit per die capacities.
“BiCS3 will feature the use of 3-bits-per-cell technology along with advances in high aspect ratio semiconductor processing to deliver higher capacity, superior performance and reliability at an attractive cost. Together with BiCS2, our 3D NAND portfolio has broadened significantly, enhancing our ability to address a full spectrum of customer applications in retail, mobile and data [...]
Toshiba and Western Digital recently announced the grand opening of their newest semiconductor manufacturing facility, Fab 2, located in Yokkaichi, Japan. Fab 2 has been construction since September 2004 through a joint partnership between Toshiba and SanDisk, the latter of which was acquired by Western Digital in May 2016. Partial completion of the facility was announced back in October 2015 and first-phase production began in March of this year.
Going forward, Fab 2 will be the primary facility responsible for the mass production of the companies’ upcoming BiCS 3D NAND product. Toshiba/SanDisk (Now, WD) unveiled their 256Gb 48-layer BiCS 3D [...]
Before NVMe and PCIe SSDs became as well known as they are today, SSD manufacturers had to find creative ways to bypass the limitations of the SATA bus for customers looking for more performance than was possible on SATA. Among the companies spearheading the PCIe SSD market was OCZ with their RevoDrive PCIe line of SSDs. While they were able to provide performance far exceeding what’s possible via the SATA interface, the first RevoDrive SSDs which were Frankensteined creations built with multiple SandForce controllers and custom OCZ virtualization chips that made everything extremely expensive and very [...]
In addition to Toshiba’s recent SG5 series SSD announcement for the client sector, Toshiba also announced the new HK4 series SSD designed for the enterprise and datacenter. Utilizing in-house 15nm MLC NAND, the Toshiba HK4 series SSDs will be available two models: the HK4R for read intensive applications and the HK4E for mixed workload applications.
The HK4R series will be available in capacities of up to 1.92TB and is designed for read intensive applications such as web servers, file servers, video on demand applications, etc. It features performance of up to 500/480 MB/s sequential read/writes and up to 75,000/14,000 IOPS 4K random [...]