Posts Tagged ‘SSD’
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July 4, 2017

Apacer’s PT920 Commando PCIe SSD Will Make You Oh So Tacticool

Are you one of those gamers who wears a full set of camo and combat boots before launching Battlefield 1? Apacer has got just the perfect SSD for you.

Aptly called the Apacer PT920 Commando, the new PT920 is a MLC NAND based PCIe x4 SSD carrying a heatsink styled off the lower of an AR-15 rifle. Apacer says this is not only an aesthetic decision, but it’s also a strategic one for improved heat dissipation.

Performance wise, the Apacer PT920 Commando features sequential read performance up to 2,500 MB/s and sequential write speeds up to 1,350 MB/s with the 480GB capacity model. The PT920 will arrive in capacities of 240GB and 480GB.

Pricing and [...]

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July 4, 2017

Samsung’s New Pyeongtaek V-NAND Fab Begins Mass Production of 64-Layer V-NAND

Samsung announced today that its new fab in Pyeongtaek, South Korea has entered mass production and is shipping its first products to customers. The newly-opened plant which will be the largest single fab in the industry will focus on production of Samsung’s latest 4th generation, 64-layer 3D V-NAND. Samsung’s 64-layer TLC 3D NAND enables capacities of up to 256Gbit per chip bringing increased performance and storage capacity to consumer and enterprise devices. The new factory represents a major step towards Samsung’s goal of shifting 50% of its production to 64-Layer 3D NAND by the end of this year.

Within the next four years, Samsung is also [...]

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June 28, 2017

Toshiba Sues Western Digital Over TMC Sale Interference, Improper Trade Secret Acquisition

Things are getting heated between Toshiba and Western Digital as Toshiba has recently filed a lawsuit against Western Digital over alleged violation of the Unfair Competition Prevention Act and Civil Code, and is seeking $120 billion yen ($1.07 billion USD) in compensation along with a permanent injunction. In their recent press release, Toshiba accused Western Digital of intentionally delaying the sale of TMC (Toshiba Memory Company) and improperly obtaining trade secrets through their joint venture partnership.

Toshiba claims that Western Digital delayed the sale of TMC by publicly and privately exaggerating its “consent right”, a clause in Western [...]

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June 16, 2017

Samsung Begins Volume Production of 64-Layer V-NAND

In a recent announcement, Samsung has begun volume production of its 4th generation, 64-layer V-NAND. The new 3D NAND flash chips are the successor to Samsung’s existing 48-layer V-NAND.

Storage capacity of the 64-layer V-NAND remains at the same 256Gbit density as the 48-layer V-NAND it’s designed to replace. The major difference with 64-layer V-NAND is the size of each chip as it’s physically smaller, allowing more chips to fit on a single wafer. This improves production efficiency as well as internal parallelism when it’s ultimately implemented on SSDs and other storage devices.

In addition to greater areal density, the new 64-layer [...]

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May 5, 2017

Samsung to Overtake Intel As World’s Largest Chipmaker

Samsung Electronics is poised to surpass Intel (aka Chipzilla) as the world’s largest chip manufacturer.

Analyst firm IC Insights predicted recently that if the current price of DRAM and NAND hold for Q2, Samsung could generate enough revenue to take the number one spot. The firm predicts that Samsung will achieve $14.9 billion in revenue, while Intel is predicted to reach $14.4 billion.

The increase in the price of NAND and DRAM is fueled by significantly increased demand amid a major industry-wide supply shortage. The depleted inventory and industry-wide transition to 3D NAND is significantly increasing the price of storage and isn’t supposed to [...]

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April 11, 2017

SK Hynix Introduces 256Gb 72-Layer TLC 3D NAND

SK Hynix is making some major advances in NAND technology as it recently announced its first 256Gb 72-layer TLC 3D NAND flash memory. SK Hynix’s 72-layer 3D NAND follows their 48-layer 3D NAND product which was released just five months ago in November 2016.

According to SK Hynix, the new 72-layer TLC 3D NAND is capable of utilizing existing manufacturing lines allowing for 30% better manufacturing efficiency, 2x faster internal operation speed, 20% higher performance, and 1.5x cell density over previous generation 48-Layer 3D NAND.

The new SK Hynix 72-layer 3D NAND will go into mass production in the 2H2017 initially targeting business use. The company [...]

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April 6, 2017

Western Digital Introduces My Passport SSD, Delivers Up to 515MB/s Over USB 3.1 Gen 2

Western Digital has released their first ever external drive powered by SSD technology.

Dubbed the My Passport SSD, the new external SSD features up to 1TB of storage in an ultraportable 1.8 inch x 3.5 inch x 0.39 inch form factor. Thanks to its SSD internals, the drive is capable of performance of up to 515MB/s over USB 3.1 Gen 2 (10Gb/s) and will feature adapters for compatibility with USB Type-A as well as USB Type-C connectors. For peace of mind, the drive also features industry standard AES 256-bit hardware encryption, and is durable enough to withstand a 6.5 foot drop and up to 1500G of force.

The WD My Passport SSD will MSRP at $99.99 for the 256GB, $199 [...]

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April 5, 2017

SSD Prices Jump 36% Year-Over-Year, Market Stabilization Not Expected Until 2018

According to a recent post by market intelligence firm TrendFocus, SSD prices have jumped over 36% year over year in certain areas despite increasing shipments suggesting demand for flash memory is currently significantly outpacing supply. Trendfocus speculates that these prices are likely to stay inflated until at least 2018, when production of flash memory is expected to increase to match demand.

The current NAND shortage has been caused by a perfect storm of factors which include the transition by all NAND manufacturers to 3D NAND production, major increases in storage capacities of smartphones and significantly increased amounts of laptops adopting SSDs. Currently, [...]

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March 29, 2017

Micron to Begin Shipping QuantX Flash Memory This Year

In a new report from ITworld, it looks like Micron may be on track to begin shipping their 3D XPoint based products by the end of this year.

After branding their 3D XPoint based products as QuantX at Flash Memory Summit last year, Micron has been relatively silent about the upcoming technology. However, with all the buzz surrounding Intel’s launch of their first 3D XPoint based SSD, Micron has returned to the spotlight. However, unlike Intel, Micron is rumored to be licensing QuantX to other manufacturers as well as ship QuantX in the form of DDR-style memory DIMMs as well.

3D XPoint has been touted as the next generation flash memory technology that [...]

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March 28, 2017

Palit Announces UFS and GFS Series SSDs

Palit is expanding its business into the SSD sector with the release of its UVS and GF-S series SSDs.

The UVS series SSD is powered by a Phison S3111-S11 controller paired with TLC NAND. Sequential read and write performance is rated at 560MB/s and 470MB/s respectively, while random read and write is rated at 290MB/s and 340MB/s.

Manufacturer Palit Model UVS10AT-SSD120 UVS-SSD256 UVS-SSD480 UVS-SSD512 Capacity 120GB 256GB 480GB 521GB NAND Planar TLC 3D TLC Sequential Read 560MB/s 560MB/s 525MB/s 525MB/s Sequential Write 375MB/s 470MB/s 465MB/s 465MB/s Random Read 280MB/s 270MB/s 290MB/s 290MB/s Random [...]
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