It’s good to be in the DRAM business these days. According to a recent report from DRAMeXchange, global DRAM revenues have increased 18.2% sequentially for 4Q2016.
Much of the demand is fueled by strong smartphone sales, particularly Chinese brands along with the iPhone 7. This has resulted in massive shortages of PC DRAM, resulting in a 30% price increase over the previous quarter. Server DRAM is expected to follow suit in 1Q2017.
Memory manufacturers are currently increasing efforts to expand DRAM production capacity, but their efforts aren’t expected to be realized until the 2H2017. As a result, the supply problem is expected to continue to [...]
In a recent report from Reuters, SK Hynix may be among the suitors in the running for a stake in Toshiba’s memory business. According to an undisclosed source, SK Hynix has already submitted an initial bid for Toshiba’s memory business although no information as to how much of a stake SK Hynix is interested in purchasing.
Toshiba had recently fallen on some hard times with a failing nuclear power business and an accounting scandal that left their previous CEO out of a job and the company in billions of dollars in debt. In an attempt to protect the still profitable memory business and help keep Toshiba alive a bit longer, Toshiba spun off the memory business [...]
According to SK Hynix 1Q2017 Databook for graphics, it’s confirmed that SK Hynix’s 4GB HBM2 memory modules are getting ready for production in 1Q2017.
One of the hottest consumer products that is expected to take advantage of HBM2 is AMD’s highly anticipated Vega graphics cards. Among the memory lineup, the 5mKGSD SKU is the most likely candidate to be featured on the Vega GPU. The 5mKGSD configuration is 4 stacks tall and features a memory density of 4GB/ stack. At CES 2017, we saw a glimpse of an engineering sample of Vega carrying 2 stacks of HBM2 on its interposer. It was rumored to have 8GB of VRAM, which helps confirm our [...]
In a recent announcement, SK Hynix launched their new 8GB LPDD4X DRAM designed for mobile devices. SK Hynix was able to achieve this by stacking four of their 16Gb dual channel DRAM dies.
Compared to traditional LPDDR4 DRAM, SK Hynix’s LPDDR4X 8GB packages reduce data IO operation voltage by 45%; operating at just 0.6V compared to the 1.1V of the LPDDR4. According to SK Hynix, the reduced data IO operation voltage should translate to 20% reduction in overall power consumption.
Additionally, the new package features a 30% smaller footprint compared to existing LPDDR4 at the same capacity. Its sub-1mm thickness also enables Package-on-Package stacking with a [...]
With both memory and NAND shortages slated to continue into the end of this year, SK Hynix reported a great 3Q2016, boasting revenues of 4.24 Trillion Korean Won ($3.7 Billion USD) and profits of 726 Billion Korean Won ($640.5 Million USD), representing an 8% increase in revenue and 60% increase in profit over 2Q2016.
According to SK Hynix, the uptick in revenues is largely due to high demand from the launch of new mobile products along with steady demand from the PC segment. DRAM bit shipments is up 8% as PC OEMs began stocking up on inventory prior to the holiday season and demand from the mobile segment has increased thanks to new mobile devices. DRAM [...]
Some keen eyes from the guys over at TechInsights recently discovered that the NAND onboard the Apple’s iPhone 7 will come from multiple sources. In a number of teardowns of the new smartphone, the iPhone 7 appears to source NAND from SK Hynix and Toshiba. While this isn’t interesting news as these companies are popular suppliers of NAND, what’s interesting is that certain capacities are using Toshiba’s 48-Layer 3D BiCS NAND, which has never been seen previously on a commercial product.
The Toshiba BiCS 3D NAND in question is the Toshiba THGBX6T1T82LFXF which is being used on the iPhone 7 256GB model. TechInsights is currently conducting a full [...]
Samsung and SK Hynix had a lot to show off in the previous weeks with back to back to back Flash Memory Summit followed by Intel Developer’s Conference and now Hot Chips.
At the HotChips conference, Samsung already talked about what to expect with GDDR6, and both Samsung and SK Hynix also talked about their work on HBM3 (or xHBM, Extreme HBM, HBMx, and whatever else it’s being called these days). HBM3 is expected to be faster, cheaper, more power efficient, and supports higher capacities than current generation HBM2. Those who missed our original article detailing HBM technology, be sure to check it out here.
According to early HBM3 specs, HBM3 will [...]
SK Hynix recently announced that they’ve began mass production of their UFS 2.1 storage solution. Ranging in capacities of 32GB, 64GB, and 128GB, SK Hynix is manufacturing their UFS 2.1 solution completely in house with their own firmware, controller, and 2nd generation 3D NAND flash.
According to SK Hynix, their UFS 2.1 storage solution is the fastest embedded flash memory in the world, boasting speeds up to 800MB/s, more than 3x the performance of eMMC 5.1 which is currently the main storage medium used in most mid-range to high end smartphones/tablets.
“SK Hynix is pleased to expect the mobile gadgets such as smartphones to enhance their performances [...]
Taiwanese technology site DigiTimes recently reported that a DRAM production issue has caused a Korean DRAM maker to scrap between 30,000-50,000 21nm DRAM wafers. According to DigiTimes’ industry sources, 21nm yields were not the issue; however, no specific reason was given for why the DRAM wafers were trashed.
DRAM prices have been falling since October 2014, but stabilized in June 2016 as chipmakers reduced production and fab capacity investment. While 30,000-50,000 DRAM wafers is unlikely to have a long term impact on DRAM prices, it may cause a short term price increase in Q3 as suppliers raise prices due to the constrained supply. DigiTimes sources report a [...]
After being the first to introduce first generation HBM with their partnership with AMD, SK Hynix has since fallen behind on second generation HBM, or HBM2, as Samsung announced that they began mass production earlier this year. While Samsung has had a comfortable lead over SK Hynix for some time, it seems like Samsung may not be the only producer of HBM2 come this fall. SK Hynix recently revealed in their product catalog that they’ll be shipping HBM2 in 3Q2016.
According to the catalog, SK Hynix will offer two 4GB, 4Hi-stack SKUs – H5VR32ESM4H-20C, which runs at 2.0Gbps (256GB/s per stack), and H5VR32ESM4H-12C, which runs at 1.6Gbps (204GB/s per [...]