Posts Tagged ‘3D NAND’
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January 21, 2017

Samsung 850 Pro 4TB Delayed Due to NAND Shortage

At CES 2017, Samsung had originally planned to launch the Samsung 850 Pro 4TB which would’ve made the Samsung 850 Pro not only the fastest consumer SATA SSD on the market, but also the highest capacity as well. However, after scouring the CES show floor for SSD related announcements and not seeing the drive on display at CES 2017, Tom’s Hardware reached out to Samsung’s PR agency for some information where they received the following:

“As a result of the worldwide NAND shortage, Samsung is focused on allocating NAND to products where we see the greatest demand. We will let you know when further updates on the 850 PRO 4TB are [...]

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January 11, 2017

CES 2017: Toshiba Puts 512GB NVMe SSD into Tiny 16x20mm BGA Form Factor

For CES 2017, Toshiba showed off its new BG series SSD in the M.2 1620 BGA and M.2 2230 form factor for ultraportables and mobile devices.

Powered by Toshiba BiCS 3D TLC NAND along with a Toshiba controller, the Toshiba BG series demonstrates the capabilities of Toshiba’s 3D TLC, scaling up to capacities of 512GB in a form factor as small as 16x20mm. In order to achieve this, Toshiba integrated the controller and the NAND into a single package, and as the drive utilizes NVMe’s Host Memory Buffer (HMB) feature which utilizes system DRAM to act as a buffer, DRAM is not required.

The Toshiba BG M.2 1620 SSDs are designed to be integrated into [...]

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December 1, 2016

NAND Flash Prices Continue to Rise as Demand Outpaces Supply

According to a recent report, NAND prices have continued their increase over the 3Q2016 thanks to constrained supply due to the transition from 2D to 3D NAND, and an increase in demand.

Demand for NAND in 3Q2016 grew by 19.6% with the biggest winner being Western Digital who increased their revenues by 26.7% in the quarter. Other big winners include Samsung and SK Hynix who saw revenue increases of 20.6% and 20.3% respectively.

Market share continues to be dominated by Samsung who holds a massive 36.6% marketshare, climbing just slightly over the quarter.

 

Source: TrendForce

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November 26, 2016

Review: Samsung 960 EVO 1TB M.2 PCIe SSD

TLC NAND and PCIe Done Right

When Samsung launched the Samsung 960 series SSD at their annual SSD Global Summit back in September, they promised two new drives – the Samsung 960 PRO and the Samsung 960 EVO.

Last month, we reviewed the Samsung 960 PRO which is designed for performance enthusiasts and professionals. In our testing, it exceeded our expectations making it the fastest M.2 PCIe SSD we’ve ever tested to date. Unforutnately, the Samsung 960 EVO wasn’t available at the time however, Samsung was hopeful that early samples would be available soon.

Fast forward and today we’ll be reviewing the Samsung 960 EVO, which is [...]

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November 15, 2016

Multiple Chinese Firms to Enter DRAM, NAND Market in 2018

Although the DRAM and NAND industry has seen quite a bit of consolidation over the past 10 years, it looks like some new players from China may be entering the market soon bringing some welcome competition to the market. According to a recent article by DigiTimes, three China based firms may be gearing up to enter the market with all three expected to begin competing for the Chinese market in 2018.

 

Yangtze River Storage Technology (YRST)

YRST, or Yangtze River Storage Technology, is the most promising of the companies as it’s backed by Tsinghua Unigroup, a Chinese state run technology company. YRST already owns a 12-inch wafer fab [...]

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October 25, 2016

SK Hynix Reports 60% Profit Increase in 3Q2016, 72-Layer 3D NAND Production to Begin in 2017

With both memory and NAND shortages slated to continue into the end of this year, SK Hynix reported a great 3Q2016, boasting revenues of 4.24 Trillion Korean Won ($3.7 Billion USD) and profits of 726 Billion Korean Won ($640.5 Million USD), representing an 8% increase in revenue and 60% increase in profit over 2Q2016.

According to SK Hynix, the uptick in revenues is largely due to high demand from the launch of new mobile products along with steady demand from the PC segment. DRAM bit shipments is up 8% as PC OEMs began stocking up on inventory prior to the holiday season and demand from the mobile segment has increased thanks to new mobile devices. [...]

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October 13, 2016

iPhone 7 Plus 32GB Has Slower Storage Than 128GB Models

Remember several days ago we reported that NAND on the iPhone 7 and 7 Plus is being dual sourced from Toshiba and SK Hynix? Remember how the iPhone 7 256GB is carrying Toshiba 48-Layer 3D NAND while the iPhone 7 32GB is carrying SK Hynix 2D Planar NAND? Well, looks like the type of NAND and NAND vendor may not be the only difference.

According to a report from GSMArena, the iPhone 7 Plus 32GB has a storage subsystem that’s substantially slower than the one found in the iPhone 7 128GB.

How slow you might ask? Well, taking a look at this chart, the difference is pretty massive, especially when it comes to write performance. Here we can [...]

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October 11, 2016

NAND Flash Prices Expected to Increase in Q4 Due to Severe Supply Shortages

According to a recent report from market intelligence firm TrendForce, supply shortages and surging demand from the 3Q2016 will continue into 4Q2016 increasing prices of NAND Flash. This will cause price increases of eMMC, eMCP and SSDs extending through the 4th quarter.

The main driver of increasing prices is due to smartphone demand. Smartphone demand has started to boom in the 2H2016 with sales of the iPhone 7 on the upswing causing major constrains on supply. Apple doubled capacities on each of the iPhone 7 models representing a substantial increase in NAND Flash consumption. Similarly, other brands such as Huawei, OPPO and Vivo are ramping up [...]

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October 6, 2016

Toshiba 48-Layer 3D BiCS NAND Discovered in Apple iPhone 7

Some keen eyes from the guys over at TechInsights recently discovered that the NAND onboard the Apple’s iPhone 7 will come from multiple sources. In a number of teardowns of the new smartphone, the iPhone 7 appears to source NAND from SK Hynix and Toshiba. While this isn’t interesting news as these companies are popular suppliers of NAND, what’s interesting is that certain capacities are using Toshiba’s 48-Layer 3D BiCS NAND, which has never been seen previously on a commercial product.

The Toshiba BiCS 3D NAND in question is the Toshiba THGBX6T1T82LFXF which is being used on the iPhone 7 256GB model. TechInsights is currently conducting a [...]

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October 6, 2016

Intel Revises 600p SSD Endurance Rating, Up to 8x Increase for 1TB Model

When Intel launched their 600P series SSDs several months ago, it was met with a very lukewarm reception. Aside from having some decent performance in extremely light workloads and being priced very competitively for a M.2 NVMe SSD, the TLC powered drive simply didn’t compete well with competitors on performance or endurance. As such, it was reviewed very poorly by a number of review sites including TechSpot and Tom’s Hardware.

In light of these reviews, it appears that Intel may be backpedaling on their previous endurance ratings.

According to Intel Director of Client SSD Strategic Planning and Product Marketing, David [...]

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