Posts Tagged ‘3D NAND’
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March 29, 2017

Micron to Begin Shipping QuantX Flash Memory This Year

In a new report from ITworld, it looks like Micron may be on track to begin shipping their 3D XPoint based products by the end of this year.

After branding their 3D XPoint based products as QuantX at Flash Memory Summit last year, Micron has been relatively silent about the upcoming technology. However, with all the buzz surrounding Intel’s launch of their first 3D XPoint based SSD, Micron has returned to the spotlight. However, unlike Intel, Micron is rumored to be licensing QuantX to other manufacturers as well as ship QuantX in the form of DDR-style memory DIMMs as well.

3D XPoint has been touted as the next generation flash memory technology that [...]

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March 28, 2017

Palit Announces UFS and GFS Series SSDs

Palit is expanding its business into the SSD sector with the release of its UVS and GF-S series SSDs.

The UVS series SSD is powered by a Phison S3111-S11 controller paired with TLC NAND. Sequential read and write performance is rated at 560MB/s and 470MB/s respectively, while random read and write is rated at 290MB/s and 340MB/s.

Manufacturer PalitModel UVS10AT-SSD120 UVS-SSD256 UVS-SSD480 UVS-SSD512Capacity 120GB 256GB 480GB 521GBNAND Planar TLC 3D TLCSequential Read 560MB/s 560MB/s 525MB/s 525MB/sSequential Write 375MB/s 470MB/s 465MB/s 465MB/sRandom Read 280MB/s 270MB/s 290MB/s 290MB/sRandom [...]
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March 21, 2017

ADATA Launches XPG SD700X Portable SSD With 3D NAND

ADATA aims to keep your storage safe with its new SD700X External SSD.

Using a shell that protects the SSD inside like an armored truck, the ADATA SD700X’s ruggedized exterior is sealed to IEC IP68 water and dustproof standards. The drive can be submerged in 1.5m-deep water for 60 minutes without being damaged. Rubber bumpers also ensure that the drive is “military-grade” shockproof. The drive also meets MIL-STD-810G 516.6 requirements. The drive is also backed by a 3-year warranty.

Resting inside the case is an SSD built using 3D TLC NAND. It comes in 256GB, 512GB, and 1TB capacities capable of running up to 440MB/430MB/s in sequential [...]

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March 13, 2017

Mainstream SSD Prices to Increase Over 10% Due to NAND Supply Shortages

In case you haven’t heard, there’s been a massive NAND shortage in the industry due to a combination of lower production along with higher than expected demand.

According to a recent report by market intelligence firm, DRAMeXchange, a division of TrendForce, mainstream client SSDs are feeling the effects of the shortage as contract prices are expected to increase over 10% in the 1Q2017. MLC based products are expected to see a price increase of 12%-16% and TLC based products are expected to see a price increase of 10%-16%. As a result of the shortage, shipments of client SSDs are expected to drop 7%-8% in 1Q2017.

Due to customer preferences, the NAND [...]

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March 6, 2017

Samsung Dominates NAND Flash Market in 4Q2016 as Industry Revenues Increase 17.8% QoQ

Amid massive shortages due to increased demand, the NAND Flash market is booming. According to latest report from market intelligence firm, TrendForce, revenues have increased a massive 17.8% quarter over quarter, now reaching a total of $12 Billion in 4Q2016.

Looking at the results, the biggest winners in the 4Q2016 is Micron, which saw revenue increase by 26.9%. This is followed by Intel which saw revenue increase by 25.7%, Western Digital by 22% and Samsung by 19.5%. Toshiba and SK Hynix saw the lowest revenue increases at 8.5% and 9% respectively.

In terms of marketshare, Samsung once again dominated the market by a massive margin. In 4Q2016, Samsung [...]

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March 3, 2017

TSMC Interested in Acquiring Stake in Toshiba Memory Business

Due to massive losses from their nuclear power business, Toshiba is spinning off their NAND manufacturing business and what was initially supposed to be a sale of just 20% of the business has turned into a majority stake. Numerous companies have been reported to be interested in acquiring the Toshiba memory business including heavy hitters such as SK Hynix, Micron, Western Digital, Tsinghua Unigroup, and more.

According to a new report from DigiTimes, it looks like pure-play foundry TSMC (Taiwanese Semiconductor Manufacturing Company) may also be interested in acquiring a stake in Toshiba’s NAND business to expand into the storage business.

According to [...]

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February 12, 2017

CES 2017: Phison Demos E8 Entry Level PCIe NVMe SSD Controller

With the NAND shortage in full effect at CES this year, SSDs didn’t really make much of an appearance at the show. However, we did get a chance to stop by controller vendor, Phison, who had a new entry level PCIe NVMe controller to show.

The new controller is the Phison E8 which is going to be the low cost brother to the Phison E7. The new controller will come in two variants: the PS5008-E8 or PS5008-E8T.

The Phison PS5008-E8 will be a PCIe Gen 3 x2 controller featuring performance up to 1.6GB/s sequential reads and 1.3GB/s sequential writes. Random read/write performance will top out at 240K/220K IOPS respectively. It’ll also feature support [...]

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February 9, 2017

Toshiba Begins Construction of Fab 6 and R&D Center

Despite Toshiba’s financial woes, their memory division is pressing on, recently announcing that they’ve begun construction on their latest semiconductor fabrication facility, Fab 6 at Yokkaichi, Japan.

Like all the other new fabs that were constructed or retrofitted, Fab 6 will be built to produce Toshiba’s latest BiCS 3D NAND flash. Construction of the new fab will occur in two phases with Phase 1 slated to be complete in the summer of 2018. This will allow Toshiba to re-evaluate and re-asses continued investment in the event NAND flash demand takes a nosedive.

In addition to Fab 6, Toshiba also announced the construction of a new Memory [...]

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February 8, 2017

Western Digital, Toshiba Introduces 512Gb, 64-layer TLC BICS 3D NAND

Western Digital and Toshiba had some great news to announce at the International Solid State Circuits Conference (ISSCC) recently as they revealed that they’ve begun initial production of their BICS3 512Gb, 64-layer TLC 3D NAND at their NAND fabrication facility at Yokkaichi, Japan.

The new 512Gb, 64-layer BICS3 TLC 3D NAND will be the highest density NAND dies announced to date, matching Samsung’s 4th Generation V-NAND which also features 64-layers and 512Gb density. Full production of the new BICS3 NAND is expected to begin in 2H2017.

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January 25, 2017

Tsinghua Unigroup to Invest $30 Billion in Nanjing Memory Fab, Increasing Total Fab Investment to $70 Billion

It’s no secret that China wants advanced chip manufacturing technology and will do whatever it takes to get it. However, after several failed attempts by China’s state sponsored technology investment group, Tsinghua Unigroup, to acquire US chip manufacturing companies such as Western Digital and Micron, it appears that they have given up on acquiring the manufacturing capability altogether and have decided invest into building their own manufacturing capability instead.

According to a recent statement from Tsinghua Unigroup, the investment group recently revealed plans to invest $30 billion into the construction and development of a DRAM and 3D NAND fab in [...]

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