When Razer acquired Nextbit in January this year, we had a feeling that they would put that acquisition to good use combining Nextbit’s smartphone engineering know-how with Razer’s own gamer twist. After just less than a year in the making, Razer unveiled their latest smartphone which may be the first decent smartphone ever produced specifically for gaming and content consumption.

The new smartphone, which Razer calls the Razer Phone, looks very similar to the Nextbit Robin, which was Nextbit’s flagship smartphone before the company was acquired by Razer. From there, Razer has made some serious enhancements to the product to make it one of the [...]

Phison today launched their new Phison PS8313 UFS 2.1 controller at FMS 2017.

Designed for top tier mobile chipsets and smartphones, the Phison PS8313 integrates their CoXProcessor 2.0 architecture currently used on Phison’s PCIe controllers for improved performance and reliability in the UFS standard. The PS8313 controller also features use of an advanced 28nm manufacturing process, a 2-lane UFS interface, an ultra compact and low power LDPC ECC engine and support for the latest 3D TLC NAND.

According to Phison’s internal testing, the PS8313 is capable of up to 920/550 MB/s sequential reads/writes and 67K/62K IOPS 4K random read performance [...]

The successor to the legendary OnePlus 3T may have been inadvertently leaked on Oppomart, a popular online Chinese marketplace.

According to the leaked product page, the list image is the same as leaked images we’ve seen previously. The phone is pictured to feature a matte black finish and a dual camera system. The fingerprint reader is expected to be placed at the front.

Additionally, a full list of specifications has been leaked as well.

Manufacturer OnePlus Model OnePlus 5 SoC Qualcomm Snapdragon 835 RAM 6GB LPDDR4 Storage 64GB / 128GB UFS 2.1 Screen 5.5″ QHD 2560 x 1440p Display Camera 12MP dual rear camera, 8MP front [...]

Palit is expanding its business into the SSD sector with the release of its UVS and GF-S series SSDs.

The UVS series SSD is powered by a Phison S3111-S11 controller paired with TLC NAND. Sequential read and write performance is rated at 560MB/s and 470MB/s respectively, while random read and write is rated at 290MB/s and 340MB/s.

Manufacturer Palit Model UVS10AT-SSD120 UVS-SSD256 UVS-SSD480 UVS-SSD512 Capacity 120GB 256GB 480GB 521GB NAND Planar TLC 3D TLC Sequential Read 560MB/s 560MB/s 525MB/s 525MB/s Sequential Write 375MB/s 470MB/s 465MB/s 465MB/s Random Read 280MB/s 270MB/s 290MB/s 290MB/s Random [...]

Officially launched in several international markets in November of last year, the Huawei Mate 9 is finally making its way to the US!

The Huawei Mate 9 is one of Huawei’s latest smartphones featuring a 5.9-inch 1920×1080 resolution display, Octa-Core Hisilicon Kirin 960 processor (ARM Cortex A73, ARM Cortex A53), 4GB RAM, Mali-G71 MP8 GPU, and 64GB of UFS 2.1 storage expandable via microSD. Connectivity options include the typical Wi-Fi, Bluetooth, LTE, GPS, Infrared and NFC. Battery capacity is rated at 4,000 mAh and is compatible with Huawei’s SuperCharge technology.

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According to a recent announcement, Samsung recently introduced the industry’s first 8GB LPDDR4 DRAM package designed for mobile applications.

In order to achieve this feat, Samsung’s 8GB LPDDR4 DRAM package packs four 10nm class 16Gb LPDDR4 dies into a single package. Samsung claims that this new 8GB LPDDR4 DRAM package is capable of up to 4,266Mbps per pin which provides up to 34GB/s throughput over a 64-bit memory bus. This is twice as fast as typical PC DRAM which operates at 2,133MHz per pin. It’s also power efficient as well with 8GB LPDDR4 DRAM consuming the same amount of power as a 4GB package of Samsung LPDDR3.

Further, the [...]

SK Hynix recently announced that they’ve began mass production of their UFS 2.1 storage solution. Ranging in capacities of 32GB, 64GB, and 128GB, SK Hynix is manufacturing their UFS 2.1 solution completely in house with their own firmware, controller, and 2nd generation 3D NAND flash.

According to SK Hynix, their UFS 2.1 storage solution is the fastest embedded flash memory in the world, boasting speeds up to 800MB/s, more than 3x the performance of eMMC 5.1 which is currently the main storage medium used in most mid-range to high end smartphones/tablets.

“SK Hynix is pleased to expect the mobile gadgets such as smartphones to enhance their [...]

A confidential Phison roadmap was recently leaked by technology site, MYCE, which shows Phison’s upcoming PS8311 UFS controller slated for launch at the end of 4Q2016. This will be followed up by a higher performance PS8313 UFS controller slated for 1Q2017.

UFS is expected to be the successor to SD and microSD technologies with significantly higher performance thanks to the UFS standard’s full duplex operation and advanced queuing features. Samsung recently launched the first ever removable UFS memory cards not too long ago.

 

Source: Myce

SD cards and all of its variants have served us very well over the years, but now with 4K video recording and even 8K video recording coming to the scene shortly, a faster, more reliable memory card is needed. The answer? UFS. UFS, or Universal Flash Storage, is a JEDEC flash storage standard which is designed to replace SD and eMMC currently used in most smartphones, portable electronics, and cameras.

Leading the charge is Samsung, who’s already implemented UFS last year in the Samsung Galaxy S6 and is now officially the first to launch a removable UFS drive. The new drive, named UFS card, will come in capacities of 32GB, 64GB, 128GB, and a massive 256GB. [...]

Samsung and Toshiba/SanDisk weren’t the only ones at FMS announcing their latest and greatest 256Gb 3-bit MLC 3D NAND. South Korean memory maker SK Hynix seems to have also figured it out by announcing that they’ll be producing their own 3rd generation 256Gb 3-bit MLC 3D NAND.

According to SK Hynix’s product roadmap, they’re already producing 2nd generation 128Gb 2-bit MLC 3D NAND and will transition to 3rd generation 256Gb 3-bit MLC 3D NAND by Q4. SK Hynix also has 3rd generation 128Gb 3-bit MLC 3D NAND as well as 3rd generation 256Gb 3-bit eMLC 3D NAND planned for 1Q2016 and 2Q2016 respectively.

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