For FMS 2017, Samsung shared several new releases along with its SSD/NAND flash roadmap for the coming years. Among the new releases include Samsung’s 96-Layer QLC (Quad Level Cell) NAND and a few new enterprise SSDs.
64-Layer 3D V-NAND Transition
Samsung is already transitioning its entire line of products to utilize 4th Generation 64-layer 3D V-NAND. Their 64-Layer 3D V-NAND has been in mass production since June of this year and promises to be 30% faster, 30% more power efficient, and 20% more reliable than previous generation 48-layer 3D V-NAND.
This could potentially mean that Samsung’s successor to the 960 Pro and 960 [...]
Following Toshiba’s announcement of their QLC BiCS 3D NAND last month, Toshiba’s FlashForward NAND development joint venture partner Western Digital recently also announced their own 4-bit per cell QLC 3D NAND product which they refer to as X4.
According to the press release, the WD’s X4 features up to 64-layers of BiCS 3D NAND with a maximum die capacity of up to 768Gb (96GB) per die, or a 50% increase in storage capacity compared to previous generation 512Gb 3-bit per cell X3 NAND.
Currently WD hasn’t revealed any information on plans for future products based on the new NAND. WD will show off the new X4 3D NAND at FMS 2017 in [...]
Over the past few months, there hasn’t been a whole lot of good news coming out of Toshiba, but here’s a recent announcement that I think we can all appreciate. In a recent announcement, Toshiba shared news that they’ve developed the industry’s first 4-bit per cell, Quad Level Cell (QLC) BiCS NAND flash memory chips.
The new QLC NAND features a 64-layer cell structure and boasts up to 768Gbit / 96GB per die making it currently the densest dies on the market. By using 16 dies, Toshiba is able to cram as much as 1.5 TB in a single package. This is a 50% increase over a comparable TLC NAND package with the same number of dies.
“From SLC [...]
FMS 2015 has been a big show this year with multiple vendors announcing new 3D NAND technologies. Alongside Toshiba’s announcement last week that they’re soon sampling their 256Gb 48-layer BiCS 3D NAND product, Toshiba also announced something very interesting at the show – QLC (Quadruple Level Cell) BiCS FLASH.
According to Toshiba, QLC BiCS is currently planned for “archival SSDs” where cost and capacity outweigh the need for performance. Toshiba believes that QLC BiCS will still carry longer endurance than current generation MLC NAND despite being able to store 4x the capacity per die. As far as I know, Toshiba is currently [...]