Following Toshiba’s announcement of their QLC BiCS 3D NAND last month, Toshiba’s FlashForward NAND development joint venture partner Western Digital recently also announced their own 4-bit per cell QLC 3D NAND product which they refer to as X4.
According to the press release, the WD’s X4 features up to 64-layers of BiCS 3D NAND with a maximum die capacity of up to 768Gb (96GB) per die, or a 50% increase in storage capacity compared to previous generation 512Gb 3-bit per cell X3 NAND.
Currently WD hasn’t revealed any information on plans for future products based on the new NAND. WD will show off the new X4 3D NAND at FMS 2017 in [...]
Apple and Samsung aren’t exactly on the best terms, but sometimes you just have to set aside your differences to ensure that you’ll have enough NAND to produce your next generation of iPhones.
According to a recent report by Digitimes, Apple suppliers SK Hynix and Toshiba are both experiencing bad yields on their 3D NAND resulting in a shortfall of as much as 30%. In order to ensure an adequate supply of NAND, Apple has reportedly turned to Samsung which not only has relatively good 3D NAND yields, but also has the manufacturing capability to handle the increased demand.
Due to poor yields, global supply of NAND is expected to remain constricted [...]
Are you one of those gamers who wears a full set of camo and combat boots before launching Battlefield 1? Apacer has got just the perfect SSD for you.
Aptly called the Apacer PT920 Commando, the new PT920 is a MLC NAND based PCIe x4 SSD carrying a heatsink styled off the lower of an AR-15 rifle. Apacer says this is not only an aesthetic decision, but it’s also a strategic one for improved heat dissipation.
Performance wise, the Apacer PT920 Commando features sequential read performance up to 2,500 MB/s and sequential write speeds up to 1,350 MB/s with the 480GB capacity model. The PT920 will arrive in capacities of 240GB and 480GB.
Pricing and [...]
Samsung announced today that its new fab in Pyeongtaek, South Korea has entered mass production and is shipping its first products to customers. The newly-opened plant which will be the largest single fab in the industry will focus on production of Samsung’s latest 4th generation, 64-layer 3D V-NAND. Samsung’s 64-layer TLC 3D NAND enables capacities of up to 256Gbit per chip bringing increased performance and storage capacity to consumer and enterprise devices. The new factory represents a major step towards Samsung’s goal of shifting 50% of its production to 64-Layer 3D NAND by the end of this year.
Within the next four years, Samsung is also [...]
Over the past few months, there hasn’t been a whole lot of good news coming out of Toshiba, but here’s a recent announcement that I think we can all appreciate. In a recent announcement, Toshiba shared news that they’ve developed the industry’s first 4-bit per cell, Quad Level Cell (QLC) BiCS NAND flash memory chips.
The new QLC NAND features a 64-layer cell structure and boasts up to 768Gbit / 96GB per die making it currently the densest dies on the market. By using 16 dies, Toshiba is able to cram as much as 1.5 TB in a single package. This is a 50% increase over a comparable TLC NAND package with the same number of dies.
“From SLC [...]
Things are getting heated between Toshiba and Western Digital as Toshiba has recently filed a lawsuit against Western Digital over alleged violation of the Unfair Competition Prevention Act and Civil Code, and is seeking $120 billion yen ($1.07 billion USD) in compensation along with a permanent injunction. In their recent press release, Toshiba accused Western Digital of intentionally delaying the sale of TMC (Toshiba Memory Company) and improperly obtaining trade secrets through their joint venture partnership.
Toshiba claims that Western Digital delayed the sale of TMC by publicly and privately exaggerating its “consent right”, a clause in Western [...]
In a recent announcement, Samsung has begun volume production of its 4th generation, 64-layer V-NAND. The new 3D NAND flash chips are the successor to Samsung’s existing 48-layer V-NAND.
Storage capacity of the 64-layer V-NAND remains at the same 256Gbit density as the 48-layer V-NAND it’s designed to replace. The major difference with 64-layer V-NAND is the size of each chip as it’s physically smaller, allowing more chips to fit on a single wafer. This improves production efficiency as well as internal parallelism when it’s ultimately implemented on SSDs and other storage devices.
In addition to greater areal density, the new [...]
Those looking for the absolute highest capacity HDDs for their NAS without breaking the bank will now have an option of purchasing the WD Red and the WD Red Pro in up to 10TB capacities.
In order to reach the new capacities, the new Red and Red Pro drives utilize WD’s HelioSeal technology where WD seals the drives and fills them with helium in order to cram more platters into the drive. This is a technology that has already been utilized on WD’s enterprise class drives, however, is now making its way into WD’s NAS drives for the first time. In addition to HelioSeal technology, the new drives will also include several NAS optimized features such as [...]
Synology has released updates to their five and eight bay NAS units, the DS1517+ and DS1817+. Launching in parallel with the new NAS units is the Synology M2D17 M.2 SATA SSD adapter and the DX517 expansion unit.
In order to accommodate the M2D17 adapter, the new DS1517+ and DS1817+ NAS units now feature a PCIe expansion slot. This allows additional expandability or a dedicated cache for those who want to utilize M.2 SSDs. Users can also install an external 10Gb Ethernet NIC or the new Synology M2D17 M.2 SATA SSD adapter. Each SSD adapter can host two M.2 SATA SSDs.
Both units come equipped with the Intel Atom C2538 CPU offers [...]
SK Hynix is making some major advances in NAND technology as it recently announced its first 256Gb 72-layer TLC 3D NAND flash memory. SK Hynix’s 72-layer 3D NAND follows their 48-layer 3D NAND product which was released just five months ago in November 2016.
According to SK Hynix, the new 72-layer TLC 3D NAND is capable of utilizing existing manufacturing lines allowing for 30% better manufacturing efficiency, 2x faster internal operation speed, 20% higher performance, and 1.5x cell density over previous generation 48-Layer 3D NAND.
The new SK Hynix 72-layer 3D NAND will go into mass production in the 2H2017 initially targeting business use. The [...]